




TECHNICAL PARAMETER
Shell material  | brass nickel plating/zinc alloy nickel/PA+GF  | 
Insulator material  | PA+GF/TPU  | 
Sealing material  | epoxy resin/rubber  | 
Contact material  | brass /phosphorus copper gold-plated  | 
Molding material  | TPU/PVC  | 
Insulation impedance  | ≥ 100 M Ω  | 
Contact impedance  | ≤ 5 m Ω  | 
Durability  | ≥ 500 cycles  | 
Applicable temperature  | -25 ℃~+80 ℃  | 
Waterproof  | IP65/IP67  | 
Executive standard  | IEC 61076-2-101  | 
ELECTRICAL PARAMETER

DIMENSION

PCB PIN BITMAP

Wiring Definition
